Foxconn and Intel team up to build next-gen AI systems
Strategic Partnership to Advance AI Infrastructure
TAIPEI, June 4 (Reuters) - Foxconn said on Thursday it will work with U.S. chipmaker Intel to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms in a move to capture booming demand for AI computing systems.
Taiwan's Foxconn, the world's largest contract electronics manufacturer, said in a statement that the partnership would combine Intel's chip technology with Foxconn's manufacturing and system-building expertise.
Focus Areas of Collaboration
AI Data Centre Equipment
The companies plan to work on equipment used in AI data centres, including server racks powered by Intel Xeon processors and AI accelerator chips. They will also focus on high-speed interconnect technologies, cooling designs and energy efficiency solutions in AI systems.
Expanding AI Applications Beyond Data Centres
Foxconn and Intel also aim to develop AI systems for use outside traditional data centres, including in factories, smart cities and robots.
Leadership and Vision
Comments from Foxconn Leadership
"Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration, and global supply chain capabilities," Foxconn Chairman and CEO Young Liu said in the statement.
Future Developments
Custom Chips and System Integration
The companies also said they would explore work on custom chips and system integration solutions.
Financial and Launch Details
Foxconn and Intel did not give details on the financial value of the collaboration, name any customers or offer a launch timeline.
(Reporting by Wen-Yee Lee; Writing by Ethan Wang; Editing by Christopher Cushing and Joe Bavier)
