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Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

Published by Global Banking & Finance Review

Posted on June 18, 2026

2 min read

· Last updated: June 18, 2026

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Intel Taps Industry Veteran Seok-Hee Lee to Boost Advanced Packaging Leadership

Intel's Strategic Moves in Advanced Packaging and Leadership

Seok-Hee Lee Appointed as Executive Vice President

June 18 (Reuters) - Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business.

Reinvigorating Intel's Manufacturing Business

The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing out on the AI boom.

Key Announcements and Partnerships

Apple Collaboration

The appointment follows President Donald Trump's announcement earlier in the day that Apple had agreed to work with Intel to design and manufacture its chips in the U.S. in a boost to the chipmaker's contract manufacturing business.

The Importance of Advanced Packaging

Advanced packaging has become increasingly important as chipmakers seek to improve performance by integrating multiple chips into a single package.

Leadership Roles and Industry Experience

Lee's Responsibilities at Intel

Lee, who will report directly to CEO Lip-Bu Tan, will lead all advanced packaging, system integration, back-end technology development and back-end manufacturing, Intel said in a statement.

Industry Background

A veteran of the semiconductor industry, Lee has led both SK On and SK Hynix as their CEO.

Other Leadership Changes

Naga Chandrasekaran's Focus

With Lee's appointment, Naga Chandrasekaran, executive vice president of Intel Foundry, will focus on front-end technology development and front-end manufacturing as Intel focuses on accelerating the ramp of 18A, Intel 14A, and future technologies.

Recent Hires and Customer Wins

In April, Intel hired Samsung foundry veteran Shawn Han to aid with its contract manufacturing effort.

Intel also landed Tesla as the first major customer for its next-generation 14A manufacturing process to make chips in the same month. The chip-making process is expected to enter mass production in 2029.

(Reporting by Juby Babu in Mexico City; Editing by Anil D'Silva)

Key Takeaways

  • Seok‑Hee Lee, with CEO experience at SK Hynix and SK On, will head all advanced packaging, system integration, back‑end tech and manufacturing at Intel (chosun.com).
  • The move aligns with Intel’s strategic emphasis on advanced packaging (EMIB, Foveros, EMIB‑T) to support heterogeneous integration and boost contract foundry competitiveness (newsroom.intel.com).
  • Advanced packaging is now core to Intel’s foundry strategy, enabling integration of CPUs, memory and accelerators, supporting customers like Tesla, and underpinning U.S. semiconductor supply‑chain resilience (tomshardware.com)

References

Frequently Asked Questions

Who is Seok-Hee Lee and what role will he have at Intel?
Seok-Hee Lee is a veteran of the semiconductor industry and has been named executive vice president of Intel's contract chip-manufacturing division to lead its advanced packaging push.
What is Intel's focus in the manufacturing business under CEO Lip-Bu Tan?
Intel is focusing on reinvigorating its manufacturing business, especially in advanced packaging and system integration, to regain its position in the chip market.
What recent partnerships and customers has Intel secured for its foundry business?
Intel secured Apple as a partner for chip design and manufacturing in the US, and landed Tesla as the first customer for its 14A process.
What is the significance of advanced packaging in semiconductor manufacturing?
Advanced packaging enables better chip performance by integrating multiple chips into a single package, making it crucial for next-generation technologies.
When will Intel's 14A chip-making process enter mass production?
Intel's next-generation 14A manufacturing process is expected to enter mass production in 2029.

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