Taiwan IC Packaging 3372.TWO · TWD

Its shares trade on Taipei Exchange under the ticker 3372.TWO. It has been listed since 3 August 2004. In the fiscal year to 31 December 2025, it reported revenue of TWD 1.10bn and a net loss of TWD 213.7m. At that date it held total assets of TWD 1.85bn and shareholders' equity of TWD 1.50bn.

Taiwan IC Packaging Corp. is engaged in the manufacture, packaging and testing of integrated circuit. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2004-08-03. The firm operates its businesses through packaging of lead frame IC products, including thin small-outline packages (TSOPs), small-outline packages (SOPs) and quad flat packages (QFPs), as well as the packaging of advanced IC products, including thin IC packages and other products. Its products are applied in the manufacture of consumer electronics, computer peripheral products, power management products, drive components, mobile phones, wireless communication products, IC tags and memory cards for portable electronic products. The firm distributes its products primarily in Taiwan, America and Asia.

Figures and description from our data supplier, not checked against the company's own report.

• Mr. Chung-Won ShuChairman of the Board, since 2008TWD 963,000
• Ms. Jingmei GuoChief Financial Officer, Head of Finance & Accounting, Corporate Governance Officer
• Mr. Zhonghe ZengGeneral Manager, Director, since 2014TWD 12.8m
• Mr. Zhongjing ChenHead of FactoryTWD 3.8m
• Mr. Xizhe DengDirector, since 2001TWD 963,000
• Mr. Longde GuoDirector, since 2019TWD 40,000
• Mr. Chia-Hsiang ChangIndependent DirectorTWD 1.0m
• Mr. Yi-Wen ChenIndependent DirectorTWD 1.0m
• Jianzhong LiuIndependent Director

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