BE Semiconductor Industries BESI.AS · EUR

Its shares trade on Euronext Amsterdam under the ticker BESI.AS. It has been listed since 4 December 1995. In the fiscal year to 31 December 2025, it reported revenue of €591.3m and net income of €131.6m. At that date it held total assets of €1.11bn and shareholders' equity of €416.4m.

BE Semiconductor Industries NV engages in the development, manufacturing, marketing, sales, and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company is headquartered in Duiven, Gelderland. The firm is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. The company operates through three segments: Die Attach, Packaging and Plating. The company develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The firm offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Figures and description from our data supplier, not checked against the company's own report.

• Mr. Richard NorbruisIndependent Chairman of the Supervisory Board, since 2023€113,125
• Mr. Richard BlickmanChairman of the Management Board, Chief Executive Officer€3.0m
• Ms. Andrea Kopp-BattagliaSenior Vice President - Finance
• Mr. Rene HendriksSenior Vice President - Sales Europe/North America, since 2018
• Mr. Jong ParkSenior Vice President - Sales and Customer Service APac
• Mr. Henk Jonge PoerinkSenior Vice President - Global Operations, since 2018
• Mr. Jeroen KleijburgSenior Vice President - Packaging, since 2018
• Mr. Chris ScanlanSenior Vice President - Technology
• Mr. Christoph ScheiringSenior Vice President - Die Attach, since 2018
• Mr. Peter WiednerSenior Vice President - Sub Micron Die Attach, since 2022
• Mr. Bart BerenbakVice President - Plating
• Mr. Seng HoVice President - Support Center Asia

Overall

85

Environment

99

Social

92

Governance

64

Data on this tab

Our data supplier

Chart on the Overview

TradingView

Nothing here is investment advice. Prices can be delayed or wrong, so check with the exchange before relying on them. Data for this page. How we cover markets.