156.00
+9.86%
Close of 9 Nov 2026, in TWD
Search any instrument
Reference data, closing prices and charts across 45,000 companies, plus crypto, commodities and currencies.
About Chipbond Technology
Its shares trade on Taipei Exchange under the ticker 6147.TWO. It has been listed since 2 January 2002. In the fiscal year to 31 December 2025, it reported revenue of TWD 21.45bn and net income of TWD 2.78bn. At that date it held total assets of TWD 54.23bn and shareholders' equity of TWD 47.37bn.
Chipbond Technology Corp. engages in the manufacture of driver integrated circuits products. The company is headquartered in Hsinchu, Hsinchu. The company went IPO on 2002-01-02. The firm provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The firm mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.
Figures and description from our data supplier, not checked against the company's own report.
Company facts
- Sector
- Information Technology
- Industry
- Semiconductors & Semiconductor Equipment
- Listed since
- 2 Jan 2002
- Website
- chipbond.com.tw ↗
Leadership
Pay as last reported
- Mr. Fei-Jain WuChairman of the Board, since 1997TWD 53.5m
- Mr. Huoo-Wen GauChief Executive Officer, since 1998TWD 38.0m
- Mr. Cheng-hung ShihGeneral Manager
- Mr. Shyh-Wey LoSenior Deputy General Manager-Management Center, Head of Finance, Corporate Governance Officer, since 2019
- Mr. Robert HsuSenior Deputy General Manager-Sales/MKT Planning Center
- Mr. Yi-Sin HuangDeputy General Manager-Sales/MKT Planning Center
- Mr. Kung-Tzu TuDeputy General Manager
- Mr. Tsung-Yu TuDeputy General Manager
- Mr. Sheng-Jen WuSenior Deputy General Manager-Manufacturing Center, since 2011
- Mr. Tsung-Hua WuDeputy General Manager-Hukou Operation Center
- Ms. Chao-Yi WangHead of Accounting
- Mr. Oliver ChangDirector
Environmental, social and governance
Scores out of 100, from our data supplier
- Overall
- 83
- Environment
- 77
- Social
- 99
- Governance
- 73
- Direct emissions (scope 1)
- 8,795.274 t
- Energy emissions (scope 2)
- 145,464.951 t
- Value chain emissions (scope 3)
- 40,116.173 t
- Women in the workforce
- 43.94%
- Carbon reduction policy
- Yes
- Human rights policy
- Yes
SWOT analysis
AI-generated by our data supplier. Not written or checked by our editors.
Strengths
- Headquartered in Hsinchu, Taiwan, with a focus on semiconductor manufacturing.
- Offers a diverse range of products including driver ICs, COG, COF, and flip chip packaging.
- Has been publicly traded since 2002, indicating established market presence.
Weaknesses
- Relies on a limited set of products for revenue generation.
- Dependent on specific industries like automotive and electronics for product applications.
- No mention of global market expansion beyond Taiwan, USA, and other regions.
Opportunities
- Growing demand for semiconductors in emerging technologies like automotive electronics.
- Potential to expand distribution in new geographic markets beyond current regions.
- Increasing adoption of LCD monitors and digital devices could boost product demand.
Threats
- Competition from other semiconductor manufacturers in the global market.
- Economic downturns could reduce demand for electronics and automotive components.
- Reliance on specific industries may expose the company to sector-specific risks.
Sources and methodology
- Data on this tab
- Our data supplier
- Chart on the Overview
- TradingView
Nothing here is investment advice. Prices can be delayed or wrong, so check with the exchange before relying on them. Data for this page. How we cover markets.