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Yeh-Chiang Technology 6124.TWO · TWD

Industrials · Taipei Exchange · 🇹🇼 Taiwan

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24.40

+1.24%

Close of 9 Nov 2026, in TWD

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About Yeh-Chiang Technology

Its shares trade on Taipei Exchange under the ticker 6124.TWO. It has been listed since 19 March 2002. In the fiscal year to 31 December 2025, it reported revenue of TWD 1.82bn and a net loss of TWD 180.2m. At that date it held total assets of TWD 4.62bn and shareholders' equity of TWD 3.04bn.

Yeh-Chiang Technology Corp. engages in the production and sales of high-tech heat pipe components and solder balls. The company is headquartered in Taipei City, Taipei. The company went IPO on 2002-03-19. The Company’s products consist of heat pipes, which are used in computer, communication and consumer electronic (3C) products for heat conduction; ball grid array (BGA) solder balls, which are used for packaging of integrated circuits (ICs); solder pastes, which are used for connectors and surface mounted technology (SMT) products, as well as light emitting diode (LED) modules and lighting fixtures. The company also distributes raw materials. The firm distributes its products within domestic market and to overseas markets.

Figures and description from our data supplier, not checked against the company's own report.

Company facts

Sector
Industrials
Industry
Electrical Equipment
Listed since
19 Mar 2002
Website
yctc.com.tw ↗

Leadership

Pay as last reported

  • Mr. Taiguang WangChairman of the Board, General Manager, since 2005
  • Mr. Minghe LiDeputy General Manager, since 2005
  • Mr. Liwen LinDeputy General Manager
  • Wenhao ZhengHead of Finance & Accounting
  • Yaling ZhengCorporate Governance Officer
  • Junya ChenDirector
  • Mr. Shifan ChenDirector, since 2011
  • Mr. Keqin LiDirector, since 2004
  • Xiuhui LiuDirector
  • Chengting WuDirector
  • Qiru ChenIndependent Director
  • Qibin HongIndependent Director

Environmental, social and governance

Scores out of 100, from our data supplier

ESG
Overall
0
Environment
0
Social
0
Governance
0

SWOT analysis

AI-generated by our data supplier. Not written or checked by our editors.

AI-generated

Strengths

  • High-tech heat pipe components for 3C products in Taiwan market
  • BGA solder balls for IC packaging with strong domestic distribution
  • LED modules and lighting fixtures expanding product portfolio

Weaknesses

  • Limited international market presence beyond Taiwan
  • Dependence on domestic market for sales revenue
  • Reliance on raw material distribution for additional income

Opportunities

  • Growing demand for heat pipes in electronics manufacturing
  • Expansion into global markets for solder balls and LED products
  • Increased adoption of SMT technology in electronics industry

Threats

  • Intense competition in electrical equipment sector
  • Fluctuating raw material costs affecting profit margins
  • Regulatory changes in electronics manufacturing standards

Sources and methodology

Data on this tab
Our data supplier
Chart on the Overview
TradingView

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