60.00
+6.76%
Close of 9 Nov 2026, in TWD
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About 3S Silicon Tech
Its shares trade on Taipei Exchange under the ticker 5297.TWO. It has been listed since 21 February 2017. In the fiscal year to 31 December 2025, it reported revenue of TWD 336.7m and net income of TWD 15.4m. At that date it held total assets of TWD 664.1m and shareholders' equity of TWD 458.5m.
3S Silicon Tech., Inc. principally engages in the research, development, and manufacturing of high-power semiconductor die-bonding equipment for packaging. The company is headquartered in Sinfong, Hsinchu. The company went IPO on 2017-02-21. The firm produces semiconductor packaging equipment. Its main products include die bonders, clip attach devices, reflow furnaces, and glue dispensers. The die bonders are classified as the back-end packaging equipment in semiconductor equipment and are used in various electronic chip packaging. The firm's products are mainly sold to Taiwan and other regions in Asia, Europe and the Americas.
Figures and description from our data supplier, not checked against the company's own report.
Company facts
- Sector
- Information Technology
- Industry
- Semiconductors & Semiconductor Equipment
- Listed since
- 21 Feb 2017
- Website
- sss-tech.com.tw ↗
Leadership
Pay as last reported
- Mr. W.J. ChangChairman of the Board, Chief Executive Officer, since 2007
- Mr. Chuanren WuDeputy General Manager-Technology Division
- Yuzhen LuoHead of Finance & Accounting
- Ms. Bihua LuDirector, since 2020
- Mr. Boning LiDirector
- Zhongmin LiuDirector
- Shengfa YeDirector
- Mr. Mengzhe YouDirector
- Mr. Jinde LiIndependent Director
- Mr. Tude YangIndependent Director
- Donglong ZhangIndependent Director
Environmental, social and governance
Scores out of 100, from our data supplier
- Overall
- 0
- Environment
- 0
- Social
- 0
- Governance
- 0
SWOT analysis
AI-generated by our data supplier. Not written or checked by our editors.
Strengths
- 3S Silicon Tech Inc's die bonders are high-power semiconductor packaging equipment used in electronic chip manufacturing.
- The company's products are primarily sold in Asia, Europe, and the Americas, expanding market reach.
- 3S Silicon Tech Inc's focus on semiconductor packaging equipment aligns with industry demand for advanced manufacturing solutions.
Weaknesses
- 3S Silicon Tech Inc's headquarters in Sinfong, Hsinchu, limits its global operational presence.
- The company's reliance on semiconductor packaging equipment may restrict diversification opportunities.
- 3S Silicon Tech Inc's products are mainly sold in Asia, Europe, and the Americas, potentially increasing regional market risks.
Opportunities
- 3S Silicon Tech Inc can expand its product line to include more advanced semiconductor packaging solutions.
- The growing demand for semiconductor equipment in Asia presents a significant market opportunity.
- 3S Silicon Tech Inc can leverage its existing market presence to enter new geographic regions.
Threats
- 3S Silicon Tech Inc faces competition from established semiconductor equipment manufacturers in Asia.
- Economic downturns in key markets like Europe and the Americas could reduce demand for semiconductor equipment.
- 3S Silicon Tech Inc's dependence on semiconductor packaging equipment may be affected by industry shifts.
Sources and methodology
- Data on this tab
- Our data supplier
- Chart on the Overview
- TradingView
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