Xintec 3374.TWO · TWD

Its shares trade on Taipei Exchange under the ticker 3374.TWO. It has been listed since 8 September 2004. In the fiscal year to 31 December 2025, it reported revenue of TWD 7.24bn and net income of TWD 1.35bn. At that date it held total assets of TWD 15.21bn and shareholders' equity of TWD 9.76bn.

Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2004-09-08. The firm primarily provides wafer level chip scale packaging and wafer level post passivation interconnection services for imaging sensors, biometric sensors, micromotors and power control components, which are applied in the manufacture of camera phones, personal computer (PC) cameras, toy cameras, security monitors, video telephones and personal digital assistants (PDAs), among others. The firm operates its businesses in domestic and overseas markets, such as the rest of Asia, Europe and North America.

Figures and description from our data supplier, not checked against the company's own report.

• Mr. CH ChenChairman of the Board, General Manager, since 2017TWD 9.5m
• Mr. Simon LinDeputy General Manager-Finance
• Mr. CT ChouCorporate Governance Officer
• Mr. C.S. YooDirector
• Mr. Robert HsiehIndependent DirectorTWD 1.1m
• Mr. Mike LiangIndependent DirectorTWD 676,000
• Mr. Wen-Yeu WangIndependent DirectorTWD 1.1m
• Ms. Stella WenIndependent DirectorTWD 1.1m

Overall

0

Environment

0

Social

0

Governance

0

Data on this tab

Our data supplier

Chart on the Overview

TradingView

Nothing here is investment advice. Prices can be delayed or wrong, so check with the exchange before relying on them. Data for this page. How we cover markets.