Fine Made Microelectronics Group Co 300671.SZ · CNY
Information Technology · Shenzhen · 🇨🇳 China
36.40
+0.86%
Close of 9 Nov 2026, in CNY
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About Fine Made Microelectronics Group Co
Its shares trade on Shenzhen under the ticker 300671.SZ. It has been listed since 5 July 2017. In the fiscal year to 31 December 2025, it reported revenue of CN¥852.4m and a net loss of CN¥183.3m. At that date it held total assets of CN¥2.67bn and shareholders' equity of CN¥1.57bn.
Fuman Microelectronics Group Co. Ltd. engages in the design of integrated circuit (IC) products. The company is headquartered in Shenzhen, Guangdong. The company went IPO on 2017-07-05. The Company’s main business mainly involves in the design, research, development, packaging, testing and sales of simulation and digital-analog mixing integrated circuits. The Company’s main products include power management chips, light emitting diode (LED) controlling and driving chips, metal-oxide-semi-conductor field-effect transistor (MOSFET) chips, wafers and other kind of chips. The firm's products are applied in various terminal electronic products in the fields of personal, family, and automobile. The firm distributes its products mainly in domestic market.
Figures and description from our data supplier, not checked against the company's own report.
Company facts
- Sector
- Information Technology
- Industry
- Semiconductors & Semiconductor Equipment
- Listed since
- 5 Jul 2017
- Employees
- 985
- Website
- superchip.cn ↗
Leadership
Pay as last reported
- Mr. Jingyu LiuChairman of the Board, General Manager, since 2014CN¥490,875
- Ms. Qiong LuoChief Financial Officer, Deputy General Manager, Secretary of the Board, Director, since 2012CN¥509,675
- Ms. Qiujuan WangAssistant General Manager, Director, since 2014CN¥106,546
- Mr. Yue LuoDirectorCN¥94,200
- Ms. Zhe XuDirector
- Mr. Tao ZhangStaff Elected Director
- Mr. Lanqing ChenIndependent Director
- Mr. Fengsen CongIndependent Director
- Mr. Jingyu LaiIndependent Director
Environmental, social and governance
Scores out of 100, from our data supplier
- Overall
- 0
- Environment
- 0
- Social
- 0
- Governance
- 0
SWOT analysis
AI-generated by our data supplier. Not written or checked by our editors.
Strengths
- Shenzhen headquarters provides access to a strong semiconductor ecosystem in China.
- 985 employees support focused R&D in analog-digital mixed IC design.
- Power management chips are key products for automotive and consumer electronics.
Weaknesses
- Limited international market presence beyond domestic Chinese market.
- Dependence on domestic market for product distribution channels.
- No mention of international expansion plans in business description.
Opportunities
- Growing demand for LED controlling chips in automotive and home electronics.
- Increasing adoption of MOSFET chips in electric vehicle markets.
- Expansion into international markets for semiconductor products.
Threats
- Intense competition from domestic semiconductor firms in China.
- Potential regulatory changes affecting semiconductor industry in CN.
- Supply chain disruptions impacting chip manufacturing in Shenzhen.
Sources and methodology
- Data on this tab
- Our data supplier
- Chart on the Overview
- TradingView
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