INNOX Advanced Materials Co 272290.KQ · KRW
Information Technology · KOSDAQ · 🇰🇷 South Korea
14,500
-1.23%
Close of 9 Nov 2026, in KRW
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About INNOX Advanced Materials Co
Its shares trade on KOSDAQ under the ticker 272290.KQ. It has been listed since 10 July 2017. In the fiscal year to 31 December 2025, it reported revenue of ₩439.63bn and net income of ₩58.02bn. At that date it held total assets of ₩1.09trn and shareholders' equity of ₩393.28bn.
Innox Advanced Materials Co., Ltd. develops and manufactures material for circuit and semiconductor. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2017-07-10. The firm produces flexible printed circuit board (FPCB) materials, such as flexible copper clad laminates (FCCLs), polyimide films and coverlay. The company also offers semiconductor packaging materials, including lead on chip (LOC) tapes, lead lock tapes (LLTs) and others, as well as organic light emitting diode (OLED) materials for displays. The firm provides its products under the brand names of INNOFLEX and INNOSEM. The firm distributes its products in domestic and overseas markets.
Figures and description from our data supplier, not checked against the company's own report.
Company facts
- Sector
- Information Technology
- Industry
- Semiconductors & Semiconductor Equipment
- Listed since
- 10 Jul 2017
- Website
- innoxamc.com ↗
Leadership
Pay as last reported
- Mr. Gyeong Hun KimPresident, Co-Chief Executive Officer, Director, since 2021
- Mr. Gyeong Ho JangCo-Chief Executive Officer, Director, since 2017₩1.10bn
- Mr. Gyeong Seop TaeVice President, Director
- Mr. Tae Seok JangManaging Director
- Mr. Gyeong Yul YimManaging Director
- Mr. Heung Gon KimAssistant Managing Director
- Mr. Jeong Min GwonAssistant Managing Director
- Mr. Myeong Seop JungAssistant Managing Director
- Mr. Won Sik KimInternal Auditor
- Mr. Yun Su KimAssistant Managing Director
- Mr. Sang Cheon ParkAssistant Managing Director
- Mr. Tae Seong ParkAssistant Managing Director
Environmental, social and governance
Scores out of 100, from our data supplier
- Overall
- 0
- Environment
- 0
- Social
- 0
- Governance
- 0
SWOT analysis
AI-generated by our data supplier. Not written or checked by our editors.
Strengths
- INNOFLEX and INNOSEM brand names enhance product recognition in semiconductor markets.
- Flexible copper clad laminates (FCCLs) and polyimide films are key products for FPCB manufacturing.
- Semiconductor packaging materials like LOC tapes and LLTs support advanced electronics production.
Weaknesses
- Headquarters in Asan, Chungcheongnam-Do may limit global market access.
- Limited product range compared to larger semiconductor material suppliers.
- Dependence on domestic and overseas market distribution channels.
Opportunities
- Growing demand for OLED materials in display technology across Asia.
- Expansion of FPCB materials in flexible electronics applications globally.
- Increasing semiconductor packaging needs in the Information Technology sector.
Threats
- Competition from established semiconductor material producers in KR.
- Economic fluctuations affecting semiconductor industry investments.
- Supply chain disruptions impacting material delivery to global clients.
Sources and methodology
- Data on this tab
- Our data supplier
- Chart on the Overview
- TradingView
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