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    Home > Top Stories > Siemens automates design process for testing new chips with advanced packaging
    Top Stories

    Siemens automates design process for testing new chips with advanced packaging

    Published by Uma Rajagopal

    Posted on September 27, 2022

    2 min read

    Last updated: February 4, 2026

    This image showcases the Siemens Digital Industries Software launch of Tessent Multi-die, which automates the design process for testing advanced packaged chips. The innovation aims to simplify chip testing in the face of evolving technology challenges.
    Siemens automates chip testing design process with advanced packaging - Global Banking & Finance Review
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    Tags:innovationtechnologycustomersfinancial servicesinvestment

    Quick Summary

    (Reuters) – Siemens Digital Industries Software, a unit of Siemens AG, on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging.

    (Reuters) – Siemens Digital Industries Software, a unit of Siemens AG, on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging.

    While chips have traditionally been packaged with one silicon tile inside, as the industry faces challenges making features on these tiles smaller and smaller to cram more computing power into them, companies including Intel are starting to stack several of them, sometimes mixing and matching different technologies, to improve performance.

    But testing these chips after they are made has been difficult as there are several layers of tiles, and Siemens’ head of the Tessent business Ankur Gupta said until now Siemens has had to work with customers on a case-by-case basis.

    Testing is a key part of the chip-making process and a port to test them has to be designed into the chip before they are made.

    “What we are doing now is taking all of those learnings and automating the solution, making it available general purpose for everybody to use,” Gupta told Reuters.

    He said making the testing process easier for chips with advanced packaging, also referred to as 2.5 and 3-dimensional packaging, will help give the new technology a boost.

    (Reporting by Jane Lanhee Lee; Editing by Stephen Coates)

    Frequently Asked Questions about Siemens automates design process for testing new chips with advanced packaging

    1What is advanced packaging?

    Advanced packaging refers to the technique of stacking multiple silicon chips together to enhance performance and efficiency, often involving different technologies.

    2What is chip testing?

    Chip testing is the process of evaluating the functionality and performance of semiconductor chips after they are manufactured to ensure they meet required specifications.

    3What is automation in software?

    Automation in software refers to the use of technology to perform tasks without human intervention, improving efficiency and reducing errors.

    4What is silicon in electronics?

    Silicon is a chemical element widely used in electronics for making semiconductors, which are essential components in computer chips and other electronic devices.

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