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Bosch, Infineon, NXP, TSMC to establish JV for German wafer fab
Global Banking & Finance Review®
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BERLIN (Reuters) – German technology group Robert Bosch said on Tuesday that it will establish a joint venture with TSMC, Infineon and
BERLIN (Reuters) – German technology group Robert Bosch said on Tuesday that it will establish a joint venture with TSMC, Infineon and NXP with the aim of building a wafer fab in Dresden, Germany, by the second half of next year.
The joint venture will be 70% owned by TSMC, with Bosch, Infineon and NXP each holding a 10% equity stake, according to a statement, and total investments are expected to exceed 10 billion euros ($10.97 billion) via equity injection, debt borrowing, and strong support from the European Union and German government.
($1 = 0.9120 euros)
(Writing by Miranda Murray, Editing by Friederike Heine)
A joint venture is a business arrangement where two or more parties agree to pool their resources for a specific project or business activity, sharing profits, losses, and control.
A wafer fab, or semiconductor fabrication plant, is a facility where semiconductor devices are manufactured on silicon wafers using various processes.
Capital investment refers to funds invested in a business to acquire or upgrade physical assets such as property, industrial buildings, or equipment.
An equity stake represents ownership in a company, typically expressed as a percentage of the total shares outstanding.
The European Union provides financial support and regulatory frameworks to encourage investments in member states, aiming to boost economic growth and sustainability.
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