Finance
Applied Materials becomes largest shareholder of advanced packaging firm BESI
Published by Global Banking & Finance Review®
Posted on April 15, 2025
2 min readLast updated: January 24, 2026
Global Banking & Finance Review®
Company
Published by Global Banking & Finance Review®
Posted on April 15, 2025
2 min readLast updated: January 24, 2026
Applied Materials becomes the largest shareholder of BESI with a 9% stake, boosting BESI's shares significantly. The move strengthens ties in semiconductor packaging technology.
By Nathan Vifflin
(Reuters) -Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer chip equipment supplier said on Monday.
The transaction makes it the largest shareholder of the Dutch company making advanced semiconductors packaging tools, above Blackrock Institutional Trust, according to LSEG data.
BESI's shares rose 9% in early trade and could see their largest one-day rise in more than a year if the gains hold.
It produces the world's most accurate hybrid bonding tool, a critical chip technology allowing two chips to be bonded directly on top of each other.
"I think that this is an astute move by (Applied Materials) to foster closer collaboration between the two companies," Timm Schulze-Melander, analyst at Redburn Atlantic, said in an email.
The purchase makes it clear Applied is not developing an alternative to BESI's hybrid bonding tech, he added.
Unlike most semiconductor packaging steps, hybrid bonding occurs much closer to the chip's production line and work together with Applied Materials' tools.
"I think shareholders will be extremely excited and will assume that Applied will eventually want to buy the entire company," Michael Roeg from Degroof Petercam said in an emailed comment.
The world's second largest computer chip equipment maker said it did not intend to seek board representation at BESI.
BESI said last November it remained committed to its independence, amid rumours involving a strategic deal with the company.
Hybrid bonding is used on the world's most advanced chips, like AMD's X3D line, where the memory chip is bonded onto the processor at TSMC.
(Reporting by Nathan Vifflin, editing by Milla Nissi)
The article discusses Applied Materials acquiring a 9% stake in BESI, making it the largest shareholder.
What impact does this investment have on BESI's share price? BESI's shares rose significantly following the announcement.
What is hybrid bonding? It's a key technology for advanced semiconductor packaging, allowing chips to be bonded directly.
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