Taiwanese IC Packaging & Testing Industry Report, 2Q 2018 Edition – ResearchAndMarkets.com

The “Taiwanese IC Packaging & Testing Industry, 2Q 2018” report has been added to ResearchAndMarkets.com’s offering.

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.6 billion in the first quarter of 2018, up year-on-year but down sequentially. The sequential decline was attributed mainly to the weak seasonal effect and quarter-end inventory clearance at upstream.

The industry is forecast to enjoy both year-on-year and sequential growth in the second quarter of 2018. While smartphone demand is slowing down, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to maintain slight growth this year.

Key Topics Covered:

 Stay Updated To Save Money & Time. Join Our Free Newsletter 
. Indepth Analysis & Opinion       . Interviews      . Exclusive Reports  
. Free Digital Magazines      News & updates      . Event Invitations 
                     
& Much More Delivered To Your Inbox For Free.
Submit
We Will Not Spam, Rent, or Sell Your Information.
All emails include an unsubscribe link. You may opt-out at any time. See our privacy policy.

 
  • Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2016 – 3Q 2018
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2016 – 3Q 2018
  • Taiwanese IC Packaging Industry Shipment Value, 1Q 2016 – 3Q 2018
  • Taiwanese IC Testing Industry Shipment Value, 1Q 2016 – 3Q 2018
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2016 – 1Q 2018
  • Taiwanese IC Packaging Industry Shipment Value by Vendors’ Tier, 1Q 2016 – 1Q 2018
  • Taiwanese IC Testing Industry Shipment Value Rankings, 1Q 2016 – 1Q 2018
  • Taiwanese IC Testing Industry Shipment Value by Vendors’ Tier, 1Q 2016 – 1Q 2018
  • Taiwanese IC Packaging Industry Shipment Value by Customers’ Origin, 1Q 2016 – 1Q 2018
  • Taiwanese IC Packaging Industry Shipment Value Share by Customers’ Origin, 1Q 2016 – 1Q 2018
  • Taiwanese IC Testing Industry Shipment Value by Customers’ Origin, 1Q 2016 – 1Q 2018
  • Taiwanese IC Testing Industry Shipment Value Share by Customers’ Origin, 1Q 2016 – 1Q 2018
  • Exchange Rate, 1Q 2016 – 1Q 2018

Companies Mentioned

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • SPIL
  • Walto

For more information about this report visit https://www.researchandmarkets.com/research/589nx7/taiwanese_ic?w=4

 Stay Updated To Save Money & Time. Join Our Free Newsletter 
. Indepth Analysis & Opinion       . Interviews      . Exclusive Reports  
. Free Digital Magazines      News & updates      . Event Invitations 
                     
& Much More Delivered To Your Inbox For Free.
Submit
We Will Not Spam, Rent, or Sell Your Information.
All emails include an unsubscribe link. You may opt-out at any time. See our privacy policy.

 
Close
Stay Updated To Save Money & Time. Join Our Free Newsletter. 
. Indepth Analysis & Opinion       Interviews          . Exclusive Reports 
. Free Digital Magazines        . News & updates        . Event Invitations
& Much More Delivered To Your Inbox For Free. 
Submit
We Will Not Spam, Rent, or Sell Your Information.
All emails include an unsubscribe link. You may opt-out at any time. See our privacy policy.
 
Close