According to a new industry report by Fact.MR, a market research and competitive intelligence provider, According to the latest study released by Fact.MR, the global 3D IC and 2.5D IC market has been forecasted to rise from a size of US$ 22.1 billion in 2024 to US$ 129.12 billion by 2034-end. Demand is projected to increase at a remarkable CAGR of 19.3% from 2024 to 2034. The growing need for high-performance computing is driving an increase in the adoption of 3D and 2.5D integrated circuits as these technologies enable the integration of more functionality in smaller packaging.

3D and 2.5D integrated circuits are becoming suitable options for applications, such as artificial intelligence (AI), data centers, and advanced mobile devices that require higher computational power and faster processing rates. 3D and 2.5D integrated circuits improve processing power while minimizing physical dimensions, making them ideal for high-performance systems that need both powerful and compact solutions.

Throughout the projection period, East Asia is forecasted to lead with a significant global market share, as the region is well known as the manufacturing hub of electronics and semiconductors. In addition, increased investment in advanced chip fabrication methods is also creating prospects for market players. Rising requirements in industries including data centers, telecommunications, and consumer electronics, are pushing sales of 3D and 2.5D integrated circuits (IC) in the North American region.

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Key Takeaways from the Market Study:

• The global market for 3D ICs and 2.5D ICs is forecasted to generate revenue worth US$ 129.12 billion by 2034.
• The market in North America is approximated to reach US$ 35.9 billion by 2034-end.
• The East Asian region is projected to hold 34.4% of the global market share by the end of 2034.
• Based on end user, the consumer electronic segment is analyzed to reach US$ 33.7 billion by 2034.
• The market in Japan is evaluated to expand at 20.5% CAGR from 2024 to 2034.
• By 2034, the market in China is forecasted to reach a value of US$ 31.14 billion.
• The market in the United States is estimated to generate a turnover of US$ 4.11 billion in 2024.

“Prominent companies in the 3D IC and 2.5D IC market are funding R&D projects to push technological advancements. These continuous developments are helping to improve performance, lower costs, and produce advanced gadgets,” says a Fact.MR analyst

Growing Utilization in the Consumer Electronic Industry

To enhance performance, reduce power consumption, and enable downsizing, the consumer electronics industry is widely using 3D and 2.5D IC technology. These integrated circuits allow the integration of more components into smaller places, which is essential for the creation of compact, high-performance devices including wearables, tablets, and smartphones.

To meet the growing demand for faster and more powerful consumer products, 3D and 2.5D integrated circuits increase processing speed and efficiency by stacking layers of circuitry or combining multiple chips into a single package.

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More Valuable Insights on Offer

Fact.MR, in its new offering, presents an unbiased analysis of the 3D IC and 2.5D IC market, presenting historical demand data (2019 to 2023) and forecast statistics for 2024 to 2034.

The study divulges essential insights into the market based on technology (3D wafer-level chip-scale packaging, 3D through-silicon via, 2.5D), application (logic, imaging & optoelectronics, memory, micro-electromechanical systems/sensors, light-emitting diode, power, analog & mixed signal, radio frequency, photonics), and end user (consumer electronics, telecommunication, industry sector, automotive, military & aerospace, smart technologies, medical devices), across seven major regions of the world (North America, Western Europe, Eastern Europe, East Asia, Latin America, South Asia & Pacific, and MEA).

Key Companies Profiled:

Samsung Electronics; Texas Instruments Inc.; JCET Group Co., Ltd.; ASE Technology Holding Co., Ltd.,; Amkor Technology; Taiwan Semiconductor Manufacturing Company; Intel Corporation; Toshiba Corp.; Broadcom Ltd.; Jiangsu Changjiang Electronics Technology Co., Ltd.; United Microelectronics Corp.; Siemens AG.

Industry News:

In July 2024, new software for the planning and heterogeneous integration of ASICs and chiplets using the new substrates and 2.5D and 3D semiconductor packaging methods was introduced by Siemens Digital Industries Software.

In October 2023, leading worldwide semiconductor foundry United Microelectronics Corporation said that to assist clients in expediting the production of their 3D products, it launched the W2W (wafer-to-wafer) 3D IC project in association with partners ASE, Faraday, Winbond, and Cadence.

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