Samsung Elec and Amd Sign MoU on AI Memory, Explore Foundry Partnership
Published by Global Banking & Finance Review®
Posted on March 18, 2026
2 min readLast updated: March 18, 2026
Published by Global Banking & Finance Review®
Posted on March 18, 2026
2 min readLast updated: March 18, 2026
Samsung and AMD inked an MoU to expand their AI-focused memory partnership, securing Samsung’s HBM4 for AMD Instinct accelerators and DDR5 for upcoming EPYC CPUs, while exploring Samsung’s foundry services for next-gen chips.
SEOUL, March 18 (Reuters) - Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday.
The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC processors, they said in a statement.
The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing services for next-generation AMD products.
Under the agreement, Samsung will position itself as a key HBM4 supplier for AMD's next-generation AI GPUs. The South Korean firm has already been a primary HBM supplier for AMD, supplying HBM3E chips used in AMD's MI350X and MI355X accelerators.
The agreement comes during the week of Nvidia's annual developer conference GTC, where CEO Jensen Huang on Monday announced a foundry partnership with the Korean firm and praised its HBM4 chips.
The tie-up highlights a broader race among global chipmakers to lock in long-term supply partnerships for advanced memory, as AI-driven demand reshapes the semiconductor industry and tightens supply of HBM chips.
Last month, AMD said it had agreed to sell up to $60 billion worth of AI chips to Meta Platforms over five years, a deal that allows the Facebook owner to purchase as much as 10% of the chips. AMD signed a similar deal with OpenAI last year.
Samsung, the world's largest memory chipmaker, has been seeking to narrow the gap with rivals in the fast-growing HBM segment. It holds about a 22% share of the global HBM market, compared with market leader SK Hynix's 57%, according to Counterpoint.
(Reporting by Heekyong YangEditing by Ed Davies)
The partnership focuses on supplying Samsung’s HBM4 and DDR5 memory for AMD’s next-generation AI accelerators and processors.
Samsung will supply next-gen HBM4 memory for Instinct MI455X AI accelerators and optimized DDR5 memory for sixth-generation EPYC processors.
Yes, they are discussing a potential foundry partnership, where Samsung could manufacture AMD's future chips.
It strengthens long-term supply partnerships for advanced memory as AI-driven demand reshapes the industry and tightens HBM chip supply.
Samsung holds about 22% of the global HBM market, while SK Hynix leads with 57%.
Explore more articles in the Finance category

