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Quad-Flat-No-Lead Packaging Market to grow at a high CAGR of 13.1%.
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The Quad-Flat-No-Lead Packaging market is set to grow at a 13.1% CAGR, driven by demand in electronics and automotive sectors, reaching over US$ 235 Bn by 2027.
Future Market Insights presents a comprehensive analysis and valuable insights on the adoption of quad-flat-no-lead packaging in various applications and sectors across the globe. The report titled “Quad-Flat-No-Lead Packaging Market: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)” covers a wide angle of the global market with the help of a detailed market segmentation. The research report also discusses various opportunities for quad-flat-no-lead packaging, various trends influencing the global market, key drivers fuelling the growth of the global market as well as restraints that have a negative impact on revenue growth of the global quad-flat-no-lead packaging market. The research report presents historic data as well as future market projections for a period of 10 years.
The global quad-flat-no-lead packaging market is projected to grow at a high CAGR of 13.1% throughout the period of forecast, 2017-2027. Around US$ 62 Bn is the market standing of the global quad-flat-no-lead packaging market and with this enormous growth rate, it is estimated to touch a valuation of more than US$ 235 Bn by the end of the year of forecast.
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Rising demand for QFN package in compact devices expected to be a lucrative growth opportunity in the coming years
In the years to follow, it is anticipated that the consumer electronics and automotive sectors would witness high growth. This substantial growth is attributed towards increased adoption of advanced technologies such as wearable devices and electronic automobile accessories.
Wearable devices such as personal medical monitoring devices, wristwatch and others are small electronic devices that re widely being used among customers thus triggering the demand for packages as compact as UQFN or QFN.
Global Quad-Flat-No-Lead Packaging Market: Forecast Highlights
The global quad-flat-no-lead packaging market is anticipated to reach a value higher than US$ 235 Bn by the end of the year of assessment from a valuation of more than US$ 68 Bn in 2017. The global market for quad-flat-no-lead packaging is projected to grow at a stellar CAGR of 13.1% throughout the period of forecast.
Global Quad-Flat-No-Lead Packaging Market: Competitive Assessment
The research report on the global market for quad-flat-no-lead packaging includes analysis on key players and presents vendor insights in a dedicated chapter. Intelligence on key players such as NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, Texas Instruments, Microchip Technology Inc., STATS ChipPAC Pte. Ltd., ASE Group, Amkor Technology, UTAC Group, Linear Technology Corporation, Henkel AG & Co., and Broadcom Limited has been included in this chapter.
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Global Quad-Flat-No-Lead Packaging Market: Segmental Snapshot
The global quad-flat-no-lead packaging market is segmented on the basis of type, QFN variants, application and by region.
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Table Of Content
1.1. Market Overview
1.2. Market Analysis
1.3. FMI Recommendations
2.1. Market Taxonomy
2.2. Market Definition
2.3. Quad Flat No-Leads Packaging – Solution Overview
3.1. Macro-Economic Factors
3.2. Opportunity Analysis
3.3. Patents Overview
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The article discusses the growth and opportunities in the Quad-Flat-No-Lead Packaging market, projected to grow at a 13.1% CAGR.
Consumer electronics and automotive sectors are major drivers due to increased adoption of advanced technologies.
The market is expected to exceed a valuation of US$ 235 Bn by the end of 2027.
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