Published by mark itwired
Posted on September 14, 2021
Nearly 3.5% annual growth is expected in the volume consumption of industrial electronics packaging solutions, in 2019. As indicated by a new market research study of Future Market Insights (FMI), nearly 70% of the demand for industrial electronics packaging is generated by industrial controls and power electronics.
More than 90% of the overall industrial electronics packaging solutions are in the rigid format. Flexible packaging formats, although rapidly gaining ground across industries, holds a negligible share in packaging of industrial electronics.
Material-wise, plastics currently hold nearly 60% share in industrial electronics packaging materials and are likely to retain dominance in the global industrial electronics packaging market. The report opines that polyethylene (PE) will remain the most rewarding segment in the industrial electronics packaging market, followed by polyvinyl chloride (PVC), according to the report.
Request a Sample Report with Table of Contents and Figures: https://www.futuremarketinsights.com/reports/sample/rep-gb-5235
North America is estimated to be the most prominent industrial electronics packaging market, the report also points to the robust growth in East Asia’s market attractiveness over the years to come. The East Asian market for industrial electronics packaging will thus remain a significant regional contender in the industrial electronics packaging landscape, according to FMI’s analysis.
In East Asia, Japan holds more than 50% of the market share, followed by China. South Asia is also cited as a highly lucrative investment pocket for manufacturers of industrial electronics packaging solutions, potentially outpacing other regional markets in terms of growth rate. Growth of South and East Asian market is attributed to robust manufacturing of consumer electronics and swelling demand for impact-resistant protective packaging solutions.
Europe is another prominent market for industrial electronics packaging, more than 60% of which is accounted by Germany. The country will continue to spearhead European market owing to towering rate of production of semiconductor components and equipment.
Manufacturers of industrial electronics packaging are eyeing business expansion across countries with high consumer electronics production, as an effort to strengthen their foothold in the global industrial electronics packaging market. Leading manufacturers of industrial electronics packaging are either based out of the US or Europe, or have a strong presence in these regions, as both the markets hold a collective share of more than 60% in the global production of industrial electronics.
Some of the key players that have been profiled in FMI’s report on the industrial electronics packaging market include DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies, Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Botron Company Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries, LLC, Summit Container Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd., Dordan Manufacturing Company, Inc., GWP Group Limited, Pure-Stat Engineered Technologies, Inc., AUER Packaging GmbH, Emballages Cre-O-Pack International Inc., and Universal Protective Packaging, Inc., among others.
1. Executive Summary
1.1. Global Market Outlook
1.2. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Key Market Trends
3.1. Key Trends Impacting the Market
3.2. Product Innovation / Development Trends
4. Global Industrial Electronics Packaging Market Demand Analysis 2014-2018 and Forecast, 2019-2029
4.1. Historical Market Volume (Tonnes) Analysis, 2014-2018
4.2. Current and Future Market Volume (Tonnes) Projections, 2019-2029
4.3. Y-o-Y Growth Trend Analysis
5. Global Industrial Electronics Packaging Market – Pricing Analysis
5.1. Regional Pricing Analysis by Packaging Type
5.2. Pricing Break-up
5.3. Global Average Pricing Analysis Benchmark
6. Global Industrial Electronics Packaging Market Demand (in Value or Size in US$ Mn) Analysis 2014-2018 and Forecast, 2019-2029
6.1. Historical Market Value (US$ Mn) Analysis, 2014-2018
6.2. Current and Future Market Value (US$ Mn) Projections, 2019-2029
6.2.1. Y-o-Y Growth Trend Analysis
6.2.2. Absolute $ Opportunity Analysis
The post Industrial Electronics Packaging Market Witness a Spike in Growth Pace Recent Improvements in Pricing Models: FMI first appeared on Market Research Blog.
Nearly 3.5% annual growth is expected in the volume consumption of industrial electronics packaging solutions, in 2019. As indicated by a new market research study of Future Market Insights (FMI), nearly 70% of the demand for industrial electronics packaging is generated by industrial controls and power electronics.
More than 90% of the overall industrial electronics packaging solutions are in the rigid format. Flexible packaging formats, although rapidly gaining ground across industries, holds a negligible share in packaging of industrial electronics.
Material-wise, plastics currently hold nearly 60% share in industrial electronics packaging materials and are likely to retain dominance in the global industrial electronics packaging market. The report opines that polyethylene (PE) will remain the most rewarding segment in the industrial electronics packaging market, followed by polyvinyl chloride (PVC), according to the report.
Request a Sample Report with Table of Contents and Figures: https://www.futuremarketinsights.com/reports/sample/rep-gb-5235
North America is estimated to be the most prominent industrial electronics packaging market, the report also points to the robust growth in East Asia’s market attractiveness over the years to come. The East Asian market for industrial electronics packaging will thus remain a significant regional contender in the industrial electronics packaging landscape, according to FMI’s analysis.
In East Asia, Japan holds more than 50% of the market share, followed by China. South Asia is also cited as a highly lucrative investment pocket for manufacturers of industrial electronics packaging solutions, potentially outpacing other regional markets in terms of growth rate. Growth of South and East Asian market is attributed to robust manufacturing of consumer electronics and swelling demand for impact-resistant protective packaging solutions.
Europe is another prominent market for industrial electronics packaging, more than 60% of which is accounted by Germany. The country will continue to spearhead European market owing to towering rate of production of semiconductor components and equipment.
Manufacturers of industrial electronics packaging are eyeing business expansion across countries with high consumer electronics production, as an effort to strengthen their foothold in the global industrial electronics packaging market. Leading manufacturers of industrial electronics packaging are either based out of the US or Europe, or have a strong presence in these regions, as both the markets hold a collective share of more than 60% in the global production of industrial electronics.
Some of the key players that have been profiled in FMI’s report on the industrial electronics packaging market include DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies, Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Botron Company Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries, LLC, Summit Container Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd., Dordan Manufacturing Company, Inc., GWP Group Limited, Pure-Stat Engineered Technologies, Inc., AUER Packaging GmbH, Emballages Cre-O-Pack International Inc., and Universal Protective Packaging, Inc., among others.
1. Executive Summary
1.1. Global Market Outlook
1.2. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Key Market Trends
3.1. Key Trends Impacting the Market
3.2. Product Innovation / Development Trends
4. Global Industrial Electronics Packaging Market Demand Analysis 2014-2018 and Forecast, 2019-2029
4.1. Historical Market Volume (Tonnes) Analysis, 2014-2018
4.2. Current and Future Market Volume (Tonnes) Projections, 2019-2029
4.3. Y-o-Y Growth Trend Analysis
5. Global Industrial Electronics Packaging Market – Pricing Analysis
5.1. Regional Pricing Analysis by Packaging Type
5.2. Pricing Break-up
5.3. Global Average Pricing Analysis Benchmark
6. Global Industrial Electronics Packaging Market Demand (in Value or Size in US$ Mn) Analysis 2014-2018 and Forecast, 2019-2029
6.1. Historical Market Value (US$ Mn) Analysis, 2014-2018
6.2. Current and Future Market Value (US$ Mn) Projections, 2019-2029
6.2.1. Y-o-Y Growth Trend Analysis
6.2.2. Absolute $ Opportunity Analysis
The post Industrial Electronics Packaging Market Witness a Spike in Growth Pace Recent Improvements in Pricing Models: FMI first appeared on Market Research Blog.
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