Search
00
GBAF Logo
trophy
Top StoriesInterviewsBusinessFinanceBankingTechnologyInvestingTradingVideosAwardsMagazinesHeadlinesTrends

Subscribe to our newsletter

Get the latest news and updates from our team.

Global Banking & Finance Review®

Global Banking & Finance Review® - Subscribe to our newsletter

Company

    GBAF Logo
    • About Us
    • Profile
    • Privacy & Cookie Policy
    • Terms of Use
    • Contact Us
    • Advertising
    • Submit Post
    • Latest News
    • Research Reports
    • Press Release
    • Awards▾
      • About the Awards
      • Awards TimeTable
      • Submit Nominations
      • Testimonials
      • Media Room
      • Award Winners
      • FAQ
    • Magazines▾
      • Global Banking & Finance Review Magazine Issue 79
      • Global Banking & Finance Review Magazine Issue 78
      • Global Banking & Finance Review Magazine Issue 77
      • Global Banking & Finance Review Magazine Issue 76
      • Global Banking & Finance Review Magazine Issue 75
      • Global Banking & Finance Review Magazine Issue 73
      • Global Banking & Finance Review Magazine Issue 71
      • Global Banking & Finance Review Magazine Issue 70
      • Global Banking & Finance Review Magazine Issue 69
      • Global Banking & Finance Review Magazine Issue 66
    Top StoriesInterviewsBusinessFinanceBankingTechnologyInvestingTradingVideosAwardsMagazinesHeadlinesTrends
    Original content: Global Banking and Finance Review - https://www.globalbankingandfinance.com

    Global Banking & Finance Review® is a global financial intelligence and recognition platform delivering authoritative insights, data-driven analysis, and institutional benchmarking across Banking, Capital Markets, Investment, Technology, and Financial Infrastructure. Global Banking & Finance Review® operates a Digital-First Banking Awards Program and framework — an industry-first digital only recognition model built for the modern financial era, delivering continuous, transparent, and data-driven evaluation of institutional performance.
    Copyright © 2010-2026 GBAF Publications Ltd - All Rights Reserved. | Sitemap | Tags | Developed By eCorpIT

    Editorial & Advertiser disclosure

    Global Banking & Finance Review® is an online platform offering news, analysis, and opinion on the latest trends, developments, and innovations in the banking and finance industry worldwide. The platform covers a diverse range of topics, including banking, insurance, investment, wealth management, fintech, and regulatory issues. The website publishes news, press releases, opinion and advertorials on various financial organizations, products and services which are commissioned from various Companies, Organizations, PR agencies, Bloggers etc. These commissioned articles are commercial in nature. This is not to be considered as financial advice and should be considered only for information purposes. It does not reflect the views or opinion of our website and is not to be considered an endorsement or a recommendation. We cannot guarantee the accuracy or applicability of any information provided with respect to your individual or personal circumstances. Please seek Professional advice from a qualified professional before making any financial decisions. We link to various third-party websites, affiliate sales networks, and to our advertising partners websites. When you view or click on certain links available on our articles, our partners may compensate us for displaying the content to you or make a purchase or fill a form. This will not incur any additional charges to you. To make things simpler for you to identity or distinguish advertised or sponsored articles or links, you may consider all articles or links hosted on our site as a commercial article placement. We will not be responsible for any loss you may suffer as a result of any omission or inaccuracy on the website.

    1. Home
    2. >Finance
    3. >Exclusive-ASML unveils EUV light source advance that could yield 50% more chips by 2030
    Finance

    Exclusive-ASML unveils EUV light source advance that could yield 50% more chips by 2030

    Published by Global Banking & Finance Review®

    Posted on February 23, 2026

    4 min read

    Last updated: February 23, 2026

    Exclusive-ASML unveils EUV light source advance that could yield 50% more chips by 2030 - Finance news and analysis from Global Banking & Finance Review
    Tags:technology

    Quick Summary

    ASML unveils a 1,000W EUV light source that could lift chip output by up to 50% by 2030. The upgrade targets 330 wafers/hour via faster tin droplets and dual-laser plasma shaping, cutting exposure times and costs.

    SAN DIEGO, California, Feb 23 (Reuters) - Researchers at ASML Holding say they have found a way to boost the power of the light source in a key chip making machine to turn out up to 50% more chips by decade's end, to help retain the Dutch company's edge over emerging U.S. and Chinese rivals.

    ASML is the world's only maker of commercial extreme ultraviolet lithography (EUV) machines, a critical tool for chipmakers such as Taiwan Semiconductor Manufacturing Co, Intel and others in producing advanced computing chips.

    "It's not a parlor trick or something like this, where we demonstrate for a very short time that it can work," Michael Purvis, ASML's lead technologist for its EUV source light, said in an interview.

    "It's a system that can produce 1,000 watts under all the same requirements that you could see at a customer," he added, speaking at the company's California facilities near San Diego.

    MACHINES CRITICAL TO CHIP PRODUCTION

    The EUV machines are so critical to chip production that U.S. governments of both parties have worked with Dutch leaders to prevent them from being shipped to China, spurring it to launch a national effort to build machines of its own.

    In the United States, at least two startups, Substrate and xLight, have raised hundreds of millions of dollars to develop American competitors to ASML's technology, with xLight securing government funding from President Donald Trump's administration.

    With the technological advance revealed on Monday, which is being reported here for the first time, ASML aims to outdistance any would-be rivals by improving the most technologically challenging aspect of the machines.

    This is the quest to generate EUV light with the right power and properties to turn out chips at high volume. The company's researchers have found a way to boost the power of the EUV light source to 1,000 watts from 600 watts now.

    The chief advantage is that greater power translates into the ability to make more chips every hour, helping to lower the cost of each.

    Chips are printed similar to a photograph, where the EUV light is shone on a silicon wafer coated with special chemicals called a photoresist. With a more powerful EUV light source, chip factories need shorter exposure times. 

    "We'd like to make sure that our customers can keep on using EUV at a much lower cost," Teun van Gogh, executive vice president for the NXE line of EUV machines at ASML, told Reuters.

    MACHINES COULD PROCESS 330 WAFERS AN HOUR BY 2030

    Van Gogh said customers should be able to process about 330 silicon wafers an hour on each machine by the end of the decade, up from 220 now. Depending on the size of a chip, each wafer can hold anywhere from scores to thousands of the devices. 

    ASML got the power boost by doubling down on an approach that already places its machines among the most complex inventions of humans.

    To produce light with a wavelength of 13.5 nanometers, ASML's machine shoots a stream of molten droplets of tin through a chamber, where a massive carbon dioxide laser heats them into plasma.

    This is a superheated state of matter in which the tin droplets become hotter than the sun and emit EUV light, to be collected by precision optic equipment supplied by Germany's Carl Zeiss AG and fed into the machine to print chips.

    The key advancements in Monday's disclosure involved doubling the number of tin drops to about 100,000 every second, and shaping them into plasma using two smaller laser bursts, as opposed to today's machines that use a single shaping burst.

    "It's very challenging, because you need to master many things, many technologies," said Jorge J. Rocca, a professor at Colorado State University whose lab focuses on laser technologies and has trained several ASML scientists.

    "What was achieved - one kilowatt - is pretty amazing."

    ASML believes the techniques it used to hit 1,000 watts will unlock continued advances in the future, Purvis said, adding, "We see a reasonably clear path toward 1,500 watts, and no fundamental reason why we couldn't get to 2,000 watts."

    (Reporting by Stephen Nellis in San Diego; Editing by Clarence Fernandez)

    Key Takeaways

    • •ASML researchers demonstrated a 1,000W EUV light source aimed at raising chip output by up to 50% by 2030.
    • •Throughput per EUV tool is targeted to rise from about 220 to roughly 330 wafers per hour by decade’s end.
    • •Advances include doubling tin droplet rates to ~100,000/sec and using dual laser bursts to shape plasma.
    • •Higher source power shortens exposure times, lowering cost per wafer for customers like TSMC and Intel.
    • •ASML seeks to outpace emerging U.S. and Chinese rivals and sees a path beyond 1,000W toward 1,500W.

    Frequently Asked Questions about Exclusive-ASML unveils EUV light source advance that could yield 50% more chips by 2030

    1What is the main topic?

    ASML revealed a 1,000W EUV light source designed to boost lithography throughput and potentially deliver up to 50% more chips by 2030, lowering chip production costs.

    2How does the 1,000W EUV source increase chip output?

    More EUV power shortens exposure times, lifting per-tool throughput toward about 330 wafers per hour by decade’s end, which improves fab productivity and cost per wafer.

    3What technical changes enabled the power boost?

    ASML doubled tin droplet rates to roughly 100,000 per second and used two smaller laser pre-pulses to shape the plasma, increasing EUV emission efficiency.

    4Who benefits from this advance?

    Advanced chipmakers such as TSMC, Intel and others that rely on EUV for leading-edge nodes stand to gain from higher throughput, shorter exposure times and lower costs.

    Why waste money on news and opinion when you can access them for free?

    Take advantage of our newsletter subscription and stay informed on the go!

    Subscribe

    More from Finance

    Explore more articles in the Finance category

    Image for Ireland, Finland, others warn against relaxing EU merger rules
    Ireland, Finland, others warn against relaxing EU merger rules
    Image for Analysis-Power drought tips Ukraine's economy into worst crisis since war's first year
    Analysis-Power drought tips Ukraine's economy into worst crisis since war's first year
    Image for Bayer files lawsuit against Johnson & Johnson, Janssen Biotech
    Bayer files lawsuit against Johnson & Johnson, Janssen Biotech
    Image for Global diesel flows further reshuffle on EU sanctions, discounted Russian exports, data shows 
    Global diesel flows further reshuffle on EU sanctions, discounted Russian exports, data shows 
    Image for Exclusive-Volvo Cars to recall 40,000 electric SUVs over battery fire risk
    Exclusive-Volvo Cars to recall 40,000 electric SUVs over battery fire risk
    Image for Winners and losers from Trump's new 15% global tariff
    Winners and losers from Trump's new 15% global tariff
    Image for European oil and gas stocks hit record high, surpassing 2007 level
    European oil and gas stocks hit record high, surpassing 2007 level
    Image for Ukrainian drones hit facility for Druzhba oil pipeline in Russia, Kyiv says
    Ukrainian drones hit facility for Druzhba oil pipeline in Russia, Kyiv says
    Image for EU lawmakers again postpone vote on US trade deal after tariff upheaval
    EU lawmakers again postpone vote on US trade deal after tariff upheaval
    Image for Instant View: Novo's CagriSema setback may shift investor focus to M&A strategy, analysts say
    Instant View: Novo's CagriSema setback may shift investor focus to M&A strategy, analysts say
    Image for US aircraft activity at Azores base is covered by bilateral treaty, Portugal says
    US aircraft activity at Azores base is covered by bilateral treaty, Portugal says
    Image for IQM Quantum Computers to list shares in US at initial $1.8 billion valuation
    IQM Quantum Computers to list shares in US at initial $1.8 billion valuation
    View All Finance Posts
    Previous Finance PostUK aircraft parts company director jailed for fraud which caused millions in losses
    Next Finance PostBanco BPM clears governance overhaul, opening door for bigger Credit Agricole role