Posted By TMR Research Insights
Posted on October 6, 2021
Transparency Market Research delivers key insights on the global embedded die packaging market. In terms of revenue, the global embedded die packaging market is estimated to expand at a CAGR of ~17% during the forecast period, owing to numerous factors, regarding which TMR offers thorough insights and forecasts in its report on the global embedded die packaging market.
The basic idea in the embedded package substrate is to implant components inside the substrate by means of a multi-step manufacturing process. A die, multiple dies, and MEMS or passives can be embedded in a side-by-side style in the core of an organic laminate substrate. For these substrates, components are connected via copper-plate generally. The embedded package resides on the board, which frees up space in a system. The embedded die packaging technology is not new and used in niche applications due to various challenges; the technology is very promising. Using its exclusive embedded die technology, companies are introducing the world’s smallest electronic components and modules.
In addition, embedded die packaging provides many options, such as tiny packages, modules, and system-in-boards (SiBs), for various applications. Passive components, such as decoupling capacitors, are routinely embedded in laminate substrates. Embedded decoupling takes advantage of the capacitance between the power and ground planes in a printed circuit board to suppress the switching noise of high-speed digital packages.
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The global embedded die packaging market has been broadly segmented into platform, application, and end-use industry. Based on platform, the market has been divided into IC package substrate, rigid PCB, and flexible PCB. In terms of application, the market has been segregated into smartphone & tablets, medical implants and wearable devices, industrial sensing devices, industrial controlling devices, industrial metering devices, military communication & power devices, aircrafts, security devices, automotive modules, communication & computing devices, and others (security cameras, access control, etc.). In terms of end-use industry, the market has been classified into consumer electronics, IT & telecommunication, healthcare, aerospace & defense, automotive, industrial, and others. Among platforms, the IC packaged substrate segment holds significant market share and is anticipated to expand at a rapid pace during the forecast period. This is primarily attributable to significant use of IC packaged substrates in various applications such as smartphones & tablets and wearable devices, automotive modules, and communication & computing devices.
Embedded Die Packaging Market: Dynamics
The electrification and automation of automobiles are leading to increasing need for semiconductor assemblies and testing, due to various simultaneous developments in the automotive market. Improvements in 3-D mapping applications, EV batteries, and augmented reality technologies, such as heads-up displays can also be seen with ongoing developments that are assembled with semiconductor chips and require packaged chips for implementation to ensure vehicle safety and best performance on roads.
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Automotive vehicles consist of electrical and electronics systems, which include sensors, actuators, alternators, battery, oxygen sensors, generator, starter solenoid, starter drive, high power electrical systems, and other devices. Thus, rise in the demand for automated vehicles is expected to fuel the growth of the global embedded die packaging market during forecast period.
Moreover, the embedded die packaging market is projected to expand significantly due to the demand for consumer electronic products such as smartphones, tablets, set-top boxes, televisions, monitors, displays, speakers, computers, refrigerators, and many other products that require semiconductor assembly. From electronic components and semiconductor designs to consumer electronics, the semiconductor and electronics manufacturing sector is moving up the value chain.
Additionally, advancement in technology and higher competition in consumer electronics semiconductors, memory chips and wafers used in consumer electronics, and wireless handsets/mobile technologies are anticipated to be an important semiconductor revenue driver, owing to the development of low-power chips, which prolong battery life, especially of portable devices.
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Embedded Die Packaging Market: Prominent Regions
According to regional analysis, Asia Pacific is a dominant region of the global embedded die packaging market. The growth of the market in the region can be attributed to the significant manufacturing ability of players operating in the Asia Pacific market to produce embedded die packaging for consumer electronics, industrial, and medical applications. China has proved to be the most diversified and dynamic embedded die packaging market. A majority of embedded die packaging is IC packaged substrates, which are used in various applications such as smartphones & tablets, medical implants, wearable devices, automotive modules, and communication & computing devices; this is anticipated to drive the embedded die packaging market in Asia Pacific over the next few years.
China held a major share of the Asia Pacific embedded die packaging market, in terms of revenue, followed by Japan, in 2019. However, in terms of revenue, the market in India is anticipated to expand at a substantial CAGR during the forecast period. North America is focusing on the adoption of embedded die packaging in order to strengthen its consumer electronics, IT & telecommunication, and automotive field. The U.S. is home to several well-established players that design and offer embedded die packaging. Thus, rising demand for embedded die packaging in consumer electronics and IT & telecommunication sectors is anticipated to boost the embedded die packaging market in North America during the forecast period. The market in Europe is estimated to witness prominent growth during the forecast period. The embedded die packaging market in Middle East & Africa and South America is expected to witness moderate growth in the near future.
Embedded Die Packaging Market: Key Players
Key players operating in the global embedded die packaging market include ASE Group, AT&S, Fujitsu Limited, General Electric, Infineon Technologies AG, Microsemi Corporation, STMicroelectronics, TDK Corporation, Texas Instruments Incorporation, and Toshiba Corporation.
About Us
Transparency Market Research is a next-generation market intelligence provider, offering fact-based solutions to business leaders, consultants, and strategy professionals. Our reports are single-point solutions for businesses to grow, evolve, and mature. Our real-time data collection methods along with ability to track more than one million high growth niche products are aligned with your aims. The detailed and proprietary statistical models used by our analysts offer insights for making right decision in the shortest span of time. For organizations that require specific but comprehensive information, we offer customized solutions through adhoc reports. These requests are delivered with the perfect combination of right sense of fact-oriented problem solving methodologies and leveraging existing data repositories.
TMR believes that unison of solutions for clients-specific problems with right methodology of research is the key to help enterprises reach right decision.
Contact Us
Mr. Rohit Bhisey
Transparency Market Research
USA – Canada Toll Free: 866-552-3453
Email: [email protected]
Blog: https://tmrblog.com/
Transparency Market Research delivers key insights on the global embedded die packaging market. In terms of revenue, the global embedded die packaging market is estimated to expand at a CAGR of ~17% during the forecast period, owing to numerous factors, regarding which TMR offers thorough insights and forecasts in its report on the global embedded die packaging market.
The basic idea in the embedded package substrate is to implant components inside the substrate by means of a multi-step manufacturing process. A die, multiple dies, and MEMS or passives can be embedded in a side-by-side style in the core of an organic laminate substrate. For these substrates, components are connected via copper-plate generally. The embedded package resides on the board, which frees up space in a system. The embedded die packaging technology is not new and used in niche applications due to various challenges; the technology is very promising. Using its exclusive embedded die technology, companies are introducing the world’s smallest electronic components and modules.
In addition, embedded die packaging provides many options, such as tiny packages, modules, and system-in-boards (SiBs), for various applications. Passive components, such as decoupling capacitors, are routinely embedded in laminate substrates. Embedded decoupling takes advantage of the capacitance between the power and ground planes in a printed circuit board to suppress the switching noise of high-speed digital packages.
Request a Sample – https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=62343
The global embedded die packaging market has been broadly segmented into platform, application, and end-use industry. Based on platform, the market has been divided into IC package substrate, rigid PCB, and flexible PCB. In terms of application, the market has been segregated into smartphone & tablets, medical implants and wearable devices, industrial sensing devices, industrial controlling devices, industrial metering devices, military communication & power devices, aircrafts, security devices, automotive modules, communication & computing devices, and others (security cameras, access control, etc.). In terms of end-use industry, the market has been classified into consumer electronics, IT & telecommunication, healthcare, aerospace & defense, automotive, industrial, and others. Among platforms, the IC packaged substrate segment holds significant market share and is anticipated to expand at a rapid pace during the forecast period. This is primarily attributable to significant use of IC packaged substrates in various applications such as smartphones & tablets and wearable devices, automotive modules, and communication & computing devices.
Embedded Die Packaging Market: Dynamics
The electrification and automation of automobiles are leading to increasing need for semiconductor assemblies and testing, due to various simultaneous developments in the automotive market. Improvements in 3-D mapping applications, EV batteries, and augmented reality technologies, such as heads-up displays can also be seen with ongoing developments that are assembled with semiconductor chips and require packaged chips for implementation to ensure vehicle safety and best performance on roads.
Request For PDF Brochure – https://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=62343
Automotive vehicles consist of electrical and electronics systems, which include sensors, actuators, alternators, battery, oxygen sensors, generator, starter solenoid, starter drive, high power electrical systems, and other devices. Thus, rise in the demand for automated vehicles is expected to fuel the growth of the global embedded die packaging market during forecast period.
Moreover, the embedded die packaging market is projected to expand significantly due to the demand for consumer electronic products such as smartphones, tablets, set-top boxes, televisions, monitors, displays, speakers, computers, refrigerators, and many other products that require semiconductor assembly. From electronic components and semiconductor designs to consumer electronics, the semiconductor and electronics manufacturing sector is moving up the value chain.
Additionally, advancement in technology and higher competition in consumer electronics semiconductors, memory chips and wafers used in consumer electronics, and wireless handsets/mobile technologies are anticipated to be an important semiconductor revenue driver, owing to the development of low-power chips, which prolong battery life, especially of portable devices.
Buy Our Premium Research Report at – https://www.transparencymarketresearch.com/checkout.php?rep_id=62343<ype=S
Embedded Die Packaging Market: Prominent Regions
According to regional analysis, Asia Pacific is a dominant region of the global embedded die packaging market. The growth of the market in the region can be attributed to the significant manufacturing ability of players operating in the Asia Pacific market to produce embedded die packaging for consumer electronics, industrial, and medical applications. China has proved to be the most diversified and dynamic embedded die packaging market. A majority of embedded die packaging is IC packaged substrates, which are used in various applications such as smartphones & tablets, medical implants, wearable devices, automotive modules, and communication & computing devices; this is anticipated to drive the embedded die packaging market in Asia Pacific over the next few years.
China held a major share of the Asia Pacific embedded die packaging market, in terms of revenue, followed by Japan, in 2019. However, in terms of revenue, the market in India is anticipated to expand at a substantial CAGR during the forecast period. North America is focusing on the adoption of embedded die packaging in order to strengthen its consumer electronics, IT & telecommunication, and automotive field. The U.S. is home to several well-established players that design and offer embedded die packaging. Thus, rising demand for embedded die packaging in consumer electronics and IT & telecommunication sectors is anticipated to boost the embedded die packaging market in North America during the forecast period. The market in Europe is estimated to witness prominent growth during the forecast period. The embedded die packaging market in Middle East & Africa and South America is expected to witness moderate growth in the near future.
Embedded Die Packaging Market: Key Players
Key players operating in the global embedded die packaging market include ASE Group, AT&S, Fujitsu Limited, General Electric, Infineon Technologies AG, Microsemi Corporation, STMicroelectronics, TDK Corporation, Texas Instruments Incorporation, and Toshiba Corporation.
About Us
Transparency Market Research is a next-generation market intelligence provider, offering fact-based solutions to business leaders, consultants, and strategy professionals. Our reports are single-point solutions for businesses to grow, evolve, and mature. Our real-time data collection methods along with ability to track more than one million high growth niche products are aligned with your aims. The detailed and proprietary statistical models used by our analysts offer insights for making right decision in the shortest span of time. For organizations that require specific but comprehensive information, we offer customized solutions through adhoc reports. These requests are delivered with the perfect combination of right sense of fact-oriented problem solving methodologies and leveraging existing data repositories.
TMR believes that unison of solutions for clients-specific problems with right methodology of research is the key to help enterprises reach right decision.
Contact Us
Mr. Rohit Bhisey
Transparency Market Research
USA – Canada Toll Free: 866-552-3453
Email: [email protected]
Blog: https://tmrblog.com/
