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    3. >Top semiconductor lab imec eyes 'programmable' AI chips, CEO says
    Headlines

    Top Semiconductor Lab Imec Eyes 'programmable' AI Chips, CEO Says

    Published by Global Banking & Finance Review®

    Posted on May 19, 2025

    2 min read

    Last updated: January 23, 2026

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    Quick Summary

    Imec's CEO calls for programmable AI chips to match rapid AI innovation, avoiding bottlenecks and stranded assets in hardware development.

    Imec CEO Highlights Need for Programmable AI Chip Innovation

    By Nathan Vifflin

    AMSTERDAM (Reuters) -The CEO of imec, one of the world's top semiconductor R&D firms, has said the industry needs to steer towards reconfigurable chip architectures if it wants to avoid becoming a bottleneck for the future generations of artificial intelligence.

    Rapid AI algorithm innovation outpaces the current strategy of developing specific, raw-power-focused chips, leading to major drawbacks in energy, cost and hardware development speed, CEO Luc Van den hove said in a statement seen by Reuters ahead of its publication.

    "There is a huge inherent risk of stranded assets because by the time the AI hardware is finally ready, the fast-moving AI software community may have taken a different turn," he said.

    Some, like OpenAI, have taken the path of building custom chips to speed up innovation, a move Van den hove said was risky and uneconomical for most.

    The Interuniversity Microelectronics Centre (imec) pioneers many semiconductor breakthroughs that chipmakers like TSMC and Intel often widely adopt years down the line.

    As the AI industry moves beyond large language models to agentic AI and physical AI for medical or autonomous driving applications, Van den hove sees future chips regrouping all necessary capabilities into building blocks called supercells.

    "A network-on-chip will steer and reconfigure these supercells so they can be quickly adapted to the latest algorithm requirements," Van den hove said.

    This will require true three dimensional stacking, a manufacturing technique where layers of logic and memory silicon are bonded together, he added.

    Belgium-based imec was a significant contributor to the advancement and refinement of 3D stacking, a technology that will be featured in TSMC's A14 and Intel's 18A-PT future nodes.

    The research and development firm will hold its flagship conference, ITF World, on Tuesday and Wednesday in Antwerp, Belgium.

    (Reporting by Nathan Vifflin in Amsterdam, editing by Milla Nissi-Prussak)

    Key Takeaways

    • •Imec's CEO suggests reconfigurable chip architectures for AI.
    • •Current AI chip strategies are outpaced by algorithm innovation.
    • •Programmable chips can prevent stranded assets in AI hardware.
    • •Future AI chips may use supercells for adaptability.
    • •3D stacking is crucial for future AI chip development.

    Frequently Asked Questions about Top semiconductor lab imec eyes 'programmable' AI chips, CEO says

    1What is the main topic?

    The article discusses the need for programmable AI chips to keep up with rapid AI algorithm advancements.

    2Why are programmable AI chips important?

    They prevent bottlenecks and stranded assets by adapting to fast-evolving AI software requirements.

    3What role does imec play in AI chip development?

    Imec pioneers semiconductor breakthroughs, influencing major chipmakers like TSMC and Intel.

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